Basics

What is it?

Reflow soldering is the process used to attach surface mount components to a PCB board. It’s convenient for boards with small components, many components, and for consistent solder joints. Unlike traditional soldering, reflow soldering relies on heating the entire board to match a temperature profile unique to the solder paste. Temperature profiles are designed to melt solder paste across the board, hold it at high temperature to form joints, then cool it quickly to solidify welds.

How it Works:

  1. Solder paste is applied to pads on a PCB board with a stencil template for accurate placement.
  2. Components are placed in paste, which holds them in place.
  3. PCB board goes through a full temperature profile in the oven:
    1. Oven is heated to melting temperature of solder paste— solder melts.
    2. Oven is held at solder paste melting point— solder flows.
    3. Oven is quickly cooled to room temperature— solder solidifies
  4. PCB board is finished!

Safety

Temperature Hazards

Ventilation Hazards

Step-by-Step Guides

Running Pre-Made Heating Profile